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E mail
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Tel(82) 052-217-2273
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OfficeEngineering Bldg.III, Rm. 401-1
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Lab NameDigital Processor & System-on-Chip (DiPS) Lab
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Website
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Star Library
The Digital Processor & System-on-Chip (DiPS) Lab focuses on HW-friendly algorithm optimizations, digital computing architectures, and circuit implementations for intelligent computing systems. Our mission is to bridge the gap between algorithmic innovation and hardware realization by co-designing across algorithm, architecture, and circuit levels. By integrating research efforts, we aim to develop digital systems that enable next-generation applications.
[Curriculum Vitae]• 2025 ~ Present: Assistant Professor, Department of Electrical Engineering, UNIST
• 2024 ~ 2025: Postdoctoral Researcher, POSTECH
• 2023 ~ 2023: Visiting Researcher, University of Michigan, USA
• 2024: Ph.D. Electrical Engineering, POSTECH
• 2020: M.S. Electrical Engineering, POSTECH
• 2018: B.S. Electrical Engineering, POSTECH
• Digital VLSI design
• Domain-specific computing systems
• HW/SW co-design
• Embedded System-on-Chip
• AI accelerator design
• Next-generation wireless communications
• D. Kam, M. Yun, S. Yoo, S. Hong, Z. Zhang, and Y. Lee, “Panacea: Novel DNN accelerator using accuracy-preserving asymmetric quantization and energy-saving bit-slice sparsity,” IEEE International Symposium on High-Performance Computer Architecture (HPCA), Las Vegas, NV, USA, Mar. 2025.
• D. Kam, S. Yun, J. Choe, Z. Zhang, N. Lee, and Y. Lee, “A 21.9 ns, 15.7 Gbps/mm^2 (128, 15) BOSS FEC decoder for 5G/6G URLLC applications,” IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, CA, USA, Feb. 2024.
• D. Kam, B. Y. Kong, and Y. Lee, “Low-latency SCL polar decoder architecture using overlapped pruning operations,” IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 70, no. 3, pp. 1417-1427, Mar. 2023.
• D. Kam, B. Y. Kong, and Y. Lee, “A 1.1µs 1.56Gb/s/mm^2 cost-efficient large-list SCL polar decoder using fully-reusable LLR buffers in 28nm CMOS technology,” IEEE Symposium on VLSI Technology and Circuits (VLSI), Honolulu, HI, USA, June 2022.
• D. Kam*, J. G. Min*, J. Yoon, S. Kim, S. Kang, and Y. Lee, “Design and evaluation frameworks for advanced RISC-based ternary processor,” IEEE/ACM Design, Automation and Test in Europe (DATE), Antwerp, Belgium, Mar. 2022.
• Chip Design Contest Best Poster Award, ISOCC, 2025
• Best Live Demo Award, APCCAS, 2025
• Best Paper Award, Samsung-POSTECH Research center, 2024
• Postdoctoral Fellowship (PIURI), granted by POSTECH, 2024
• POSTECHIAN Fellowship, granted by POSTECH EE, 2024
• International Research Scholarship, granted by KIAT (SNU), 2022
• IEEE SSCS Seoul Chapter Award (Best Design Award), ISOCC, 2020
• Samsung Humantech Encouragement Paper Award, 2019
