Faculty

Bio-inspired Advanced Sensors Laboratory (BIAS) aims to realize self-contained smart microsystems that will seamlessly interface people to nature, machine, and even their own bodies with many electronic devices. The system will be implemented on a single-chip platform based on modern analog and digital VLSI circuits and systems technology. We are especially interested in imaging and bio-related applications for point-of-care diagnostics, human-machine interfaces, and novel implantable prosthetics.

[Curriculum Vitae]

● 2015-Present: Associate Professor, Department of Electrical Engineering, UNIST
● 2012-2015: Scientist II, Institute of Microelectonics, A*STAR, Singapore
● 2008-2012: Research Staff Member, Samsung Advanced Institute of Technology

[Education]

● 2008: Ph.D. in Electrical Engineering, KAIST
● 2003: M.S. in Electrical Engineering, KAIST
● 2001: B.S. in Electrical Engineering, Postech

[Research  Keywords and Topics]

Analog integrated circuits and systems
Image sensors
Biomedical interface circuits and systems
Circuits and systems for emerging applications
Semiconductor design

[Publications (selected)]

● J.-H. Park, J.-H. Hwang, C. Shin, and S.-J. Kim*, “A BJT-Based Temperature-to-Frequency Converter with ±1°C (3σ) Inaccuracy from -40°C to 140°C for On-Chip Thermal Monitoring,” IEEE J. Solid-State Circuits, vol. 57, no. 10, pp. 2909-2918, Oct. 2022.
● J. Kang, Y. Park, J.-H. Hwang, J.-H. Chun, J. Choi, and S.-J. Kim*, “A 640×480 Indirect Time-of-Flight Image Sensor with Tetra Pixel Architecture for Tap Mismatch Calibration and Motion Artifact Suppression,” in IEEE Symp. VLSI Circuits, Jun. 2022, pp. 44-45.
● Y. Park, J.-H. Cha, S.-H. Han, J.-H. Park, and S.-J. Kim*, “A 3.8-µW 1.5-NEF 15-Gohm Total Input Impedance Chopper Stabilized Amplifier with Auto-calibrated Dual Positive Feedback in 110nm CMOS,” IEEE J. Solid-State Circuits, vol. 57, no. 8, pp. 2449-2461, Aug. 2022.
● J.-H. Cha, J.-H. Park, Y. Park, H. Shin, K. S. Hwang, I.-J. Cho, and S.-J. Kim*, “A Reconfigurable Sub-Array Multiplexing Microelectrode Array System with 24,320 Electrodes and 380 Readout Channels for Investigating Neural Communication,” in IEEE Int. Solid-State Circuits Conf. (ISSCC), Feb. 2022, pp. 342-343.
● S. Park, B. Kim, J. Cho, J.-H. Chun, J. Choi, and S.-J. Kim*, “An 80×60 Flash LiDAR Sensor with In-Pixel Histogramming TDC Based on Quaternary Search and Time-Gated Δ-Intensity Phase Detection for 45m Detectable Range and Background Light Cancellation,” in IEEE Int. Solid-State Circuits Conf. (ISSCC), Feb. 2022, pp. 98-99.

[Awards/ Honors/ Memberships]

● Best Runner-up Paper Award, IEEE Int. Symp. Circuits Syst. (ISCAS), 2023
● Best Paper Award, 대한전자공학회 하계학술대회, 2022
● Silkroad Award, IEEE Int. Solid-State Circuits Conf. (ISSCC), 2021
● Silkroad Award, IEEE Int. Solid-State Circuits Conf. (ISSCC), 2020
● International TPC Member, IEEE Int. Solid-State Circuits Conf. (ISSCC), 2019-2023